JPH085952Y2 - マガジンガイド装置 - Google Patents

マガジンガイド装置

Info

Publication number
JPH085952Y2
JPH085952Y2 JP6014890U JP6014890U JPH085952Y2 JP H085952 Y2 JPH085952 Y2 JP H085952Y2 JP 6014890 U JP6014890 U JP 6014890U JP 6014890 U JP6014890 U JP 6014890U JP H085952 Y2 JPH085952 Y2 JP H085952Y2
Authority
JP
Japan
Prior art keywords
magazine
guide
width
frame
cam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP6014890U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0420232U (en]
Inventor
聡蔵 鳥越
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaijo Corp
Original Assignee
Kaijo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaijo Corp filed Critical Kaijo Corp
Priority to JP6014890U priority Critical patent/JPH085952Y2/ja
Publication of JPH0420232U publication Critical patent/JPH0420232U/ja
Application granted granted Critical
Publication of JPH085952Y2 publication Critical patent/JPH085952Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Stacking Of Articles And Auxiliary Devices (AREA)
  • Wire Bonding (AREA)
JP6014890U 1990-06-08 1990-06-08 マガジンガイド装置 Expired - Lifetime JPH085952Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6014890U JPH085952Y2 (ja) 1990-06-08 1990-06-08 マガジンガイド装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6014890U JPH085952Y2 (ja) 1990-06-08 1990-06-08 マガジンガイド装置

Publications (2)

Publication Number Publication Date
JPH0420232U JPH0420232U (en]) 1992-02-20
JPH085952Y2 true JPH085952Y2 (ja) 1996-02-21

Family

ID=31587258

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6014890U Expired - Lifetime JPH085952Y2 (ja) 1990-06-08 1990-06-08 マガジンガイド装置

Country Status (1)

Country Link
JP (1) JPH085952Y2 (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101035727B (zh) * 2005-09-30 2011-10-05 日高精机株式会社 散热片板收集装置

Also Published As

Publication number Publication date
JPH0420232U (en]) 1992-02-20

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